Method for manufacturing a finfet device

ABSTRACT

A method for manufacturing a semiconductor device is provided. In the method for manufacturing a semiconductor device, at first, a semiconductor substrate of a wafer is etched to form at least one fin. Then, an insulation structure is formed around the fin. Thereafter, the fin is recessed. Then, an epitaxial channel structure is epitaxially grown over the recessed fin. Thereafter, a portion of the epitaxial channel structure over a top surface of the insulation structure is removed. Then, a non-contact-type cleaning operation is performed to clean a top surface of the wafer after removing said portion of the epitaxial channel structure. Thereafter, the top surface of the wafer is cleaned using hydrogen fluoride after removing said portion of the epitaxial channel structure. Then, the insulation structure is recessed, such that the epitaxial channel structure protrudes from the recessed insulation structure.

RELATED APPLICATION

This application claims the benefit of the Provisional Applications Ser.No. 62/593,142, filed Nov. 30, 2017. The entire disclosures of all theabove applications are hereby incorporated by reference herein.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. In the course of the IC evolution, functional density (definedas the number of interconnected devices per chip area) has generallyincreased while geometry size (i.e., the smallest component (or line)that can be created using a fabrication process) has decreased. Ascaling down process generally provides benefits by increasingproduction efficiency and lowering associated costs. But, such scalingdown has increased the complexity of processing and manufacturing ICs.For example, wafer cleaning processes are performed throughout thefabrication process of an IC. However, the conventional cleaningprocesses have not been entirely satisfactory in all respects.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A to FIG. 1L are schematic structure diagrams of intermediatestages showing a method for manufacturing a FinFET device in accordancewith some embodiments of the present disclosure.

FIG. 2A is a flow chart showing a method for cleaning a wafer havingpolished epitaxial channel structures as shown in FIG. 1G.

FIG. 2B is a schematic diagram showing a rinse cleaning device inaccordance with some embodiments of the present disclosure.

FIG. 2C is a schematic diagram showing a contact-type cleaning deviceused in the contact-type cleaning operation in accordance with someembodiments of the present disclosure.

FIG. 2D is a schematic diagram showing a non-contact-type cleaningdevice used in a non-contact-type cleaning operation in accordance withsome embodiments of the present disclosure.

FIG. 2E is a flow chart showing a cleaning cycle operation in accordancewith some embodiments of the present disclosure.

FIG. 2F is a flow chart showing a cleaning cycle operation in accordancewith some embodiments of the present disclosure.

FIG. 2G is a flow chart showing a method for cleaning epitaxial channelstructures in accordance with some embodiments of the presentdisclosure.

FIG. 2H is a flow chart showing a method for cleaning epitaxial channelstructures in accordance with some embodiments of the presentdisclosure.

FIG. 2I is a flow chart showing a method for cleaning epitaxial channelstructures in accordance with some embodiments of the presentdisclosure.

FIG. 2J is a flow chart showing a method for cleaning epitaxial channelstructures in accordance with some embodiments of the presentdisclosure.

FIG. 2K shows x-ray photoelectron spectroscopy (XPS) measurements oforganic residues on a wafer in accordance with a first example.

FIG. 2L shows x-ray photoelectron spectroscopy (XPS) measurements oforganic residues on a wafer in accordance with a second example.

FIG. 3 is a flow chart showing a method for manufacturing asemiconductor device in accordance with some embodiments of the presentdisclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact.

Terms used herein are only used to describe the specific embodiments,which are not used to limit the claims appended herewith. For example,unless limited otherwise, the term “one” or “the” of the single form mayalso represent the plural form. The terms such as “first” and “second”are used for describing various devices, areas and layers, etc., thoughsuch terms are only used for distinguishing one device, one area or onelayer from another device, another area or another layer. Therefore, thefirst area can also be referred to as the second area without departingfrom the spirit of the claimed subject matter, and the others arededuced by analogy. In addition, the present disclosure may repeatreference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed. As used herein, the term “and/or” includes anyand all combinations of one or more of the associated listed items.

The FinFET may be patterned by any suitable method. For example, theFinFET may be patterned using one or more photolithography processes,including double-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over a substrate and patterned using aphotolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers may then be used to pattern theFinFET.

A surface of an epitaxial channel structure is normally hydrophobic.When a typical chemical mechanical polish (CMP) operation is conductedon the epitaxial channel structure, extra wetting agents or surfactantsare added into CMP slurry or post clean chemicals to form hydrophilicsurface. However, these wetting agents and surfactants are all organiccompounds which could induce visible or non-visible polymer residues andorganic fall-on particles on the epitaxial structure. These visible ornon-visible polymer residues and organic fall-on particles could severeimpact device performance or product yield.

A typical post CMP cleaner only provides a sponge brush, rollers, or apencil to directly contact the surface of the epitaxial channelstructure with one typical clean chemical to reduce surface defectcounts. However, the clean efficiency by using the contact-type cleanwith single chemical clean is not enough for post CMP applications ofthe epitaxial channel structure.

Embodiments of the present disclosure are directed to a method formanufacturing a FinFET device. In the method for manufacturing a FinFETdevice, a semiconductor substrate is provided. Then, an epitaxialchannel structure is formed on the semiconductor substrate. Thereafter,a polish operation is conducted on the epitaxial channel structure.Then, an integrated in-situ chemical clean operation is conducted onexposed (polished) surfaces of the epitaxial channel structure to cleanthe exposed surfaces of the epitaxial channel structure. Thereafter, agate dielectric layer and a gate electrode layer are sequentially formedon the epitaxial channel structure. Then, sources/drains are formed onthe epitaxial channel structure. The integrated in-situ chemical cleanoperation includes chemical rinse (using a solution with an oxidizingagent), contact-type clean, non-contact type clean, and chemicalcleaning cycle approaches of oxidizer/dilute hydrofluoric acid. Sincevisible or non-visible slurry residues, polymer residues, and organicfall-on particles on the surface of the epitaxial channel structure canbe effectively removed by using the integrated in-situ chemical cleanoperation, the yield performance of the FinFET device can be improved.

Referring to FIG. 1A to FIG. 1L, FIG. 1A to FIG. 1L are schematicstructure diagrams of intermediate stages showing a method formanufacturing a FinFET device in accordance with some embodiments of thepresent disclosure. As shown in FIG. 1A, a semiconductor substrate 110is provided. In some embodiments, the semiconductor substrate 110 may bea semiconductor material and may include structures including a gradedlayer or a buried oxide, for example. In some embodiments, thesemiconductor substrate 110 includes bulk silicon that may be undoped ordoped (e.g., p-type, n-type, or a combination thereof). Other materialsthat are suitable for semiconductor device formation may be used. Othermaterials, such as germanium, quartz, sapphire, and glass couldalternatively be used for the semiconductor substrate 110.Alternatively, the semiconductor substrate 110 may be an active layer ofa semiconductor-on-insulator (SOI) substrate or a multi-layeredstructure such as a silicon-germanium layer formed on a bulk siliconlayer.

As shown in FIG. 1B, the semiconductor substrate 110 is etched to formfin portions 114(referred to as “fins” hereinafter) located on a bottomportion 112. In some embodiments, the semiconductor substrate 110 isetched to form trenches 116 in the semiconductor substrate 110, therebyforming the fins 114. The etching may be any acceptable etch operation,such as a reactive ion etch (RIE), neutral beam etch (NBE), the like, ora combination thereof. In some embodiments, the etching may beanisotropic.

As shown in FIG. 1C, the trenches 116 are filled with an insulationmaterial structure 120. The insulation material structure 120 includesisolation portions 122 and a top portion 124 on the isolation portions122 and the fins 114. The isolation portions 122 are located between twoadjacent fins 114. In some embodiments, the insulation materialstructure 120 may be an oxide, such as silicon oxide, a nitride, thelike, or a combination thereof, and may be formed by a high densityplasma chemical vapor deposition (HDP-CVD), a flowable CVD (FCVD) (e.g.,a CVD-based material deposition in a remote plasma system and postcuring to make it convert to another material, such as an oxide), thelike, or a combination thereof. Other insulation materials formed by anyacceptable operation may be used. For example, the insulation materialstructure 120 is silicon oxide formed by a FCVD operation.

As shown in FIG. 1D, the top portion 124 of the insulation materialstructure 120 is removed to expose top surfaces 1145 of the fins 114. Insome embodiments, the top portion 124 of the insulation materialstructure 120 is removed by using a planarization operation, such as achemical mechanical polish (CMP), but embodiments of the presentdisclosure are not limited thereto. After the top portion 124 of theinsulation material structure 120 is removed, the isolation portions 122remain between two adjacent fins 114.

As shown in in FIG. 1E, top portions of the fins 114 are removed to formrecesses 126 defined by the isolation portions 122 of the insulationmaterial structure 120. The recesses 126 may be formed by etching usingany acceptable etch process, such as a RIE, NBE, tetramethyalammoniumhydroxide (TMAH), ammonium hydroxide (NH₄OH), a wet etchant capable ofetching silicon with good etch selectivity between silicon and amaterial of the isolation portions 124 of the insulation materialstructure 120, the like, or a combination thereof. The etching may beanisotropic. In other embodiments, the top surfaces of the fins 114 maybe etched to have different configurations.

As shown in in FIG. 1F, epitaxial channel structures, such as epitaxialfins 130, are formed in the recesses 126. The epitaxial fins 130 areconfigured to provide channel regions of field effect transistors. Forexample, a field effect transistor includes a source region and a drainregion separated by a channel region. A gate structure is locatedbetween the source regions and the drain region, and configured tocontrol the flow of charge carriers (e.g., holes or electrons) in thechannel region. Because the epitaxial fins 130 are used to provide thechannel regions, the epitaxial fins 130 may be referred to asepi-channel structures.

In some embodiments, the epitaxial fins 130 are formed by epitaxiallygrowing a material in the recesses 126, such as by metal-organic CVD(MOCVD), molecular beam epitaxy (MBE), liquid phase epitaxy (LPE), vaporphase epitaxy (VPE), selective epitaxial growth (SEG), the like, or acombination thereof. In some embodiments, a material of the epitaxialfins 130 is different from a material of the semiconductor substrate110. In some embodiments, the epitaxial fins 130 include Si, SiP, SiPC,SiGe, SiGeB, Ge or a III-V compound semiconductor. For example, theavailable materials for forming III-V compound semiconductor include,but are not limited to, InP, GaAs, AlAs, InAs, InAlAs, InGaAs, InSb,GaSb, InGaSb, and the like. In other embodiments, the epitaxial fins 130can be other material, such as silicon, silicon carbide, germanium, aII-VI compound semiconductor, or the like.

As shown in FIG. 1G, a planarization operation is conducted to polishtop of the isolation portions 122 and the epitaxial fins 130 to form aflat surface 140. In some embodiments, the planarization operation isconducted by using chemical mechanical polish (CMP), but embodiments ofthe present disclosure are not limited thereto. Because the surfaces ofthe epitaxial fins 130 are hydrophobic, extra wetting agents orsurfactants are used in the chemical mechanical polish operation.However, these wetting agents and surfactants are organic compoundsinduce visible or non-visible polymer residues and organic particles onthe surface of the epitaxial fins 130, and severe impact deviceperformance or product yield. Therefore, a method for cleaning theexposed (polished) surfaces of the epitaxial fins 130 is conducted afterthe planarization operation is conducted.

As shown in FIG. 1H, the isolation portions 122 are etched to expose topportions of the epitaxial fins 130 after the exposed surfaces of theepitaxial fins 130 are cleaned. In some embodiments, sidewalls 130W ofthe fin epitaxial fins 130 are exposed after etching the isolationportions 122. In some embodiments, the etching may be any acceptableetch operation, such as a reactive ion etch (RIE), neutral beam etch(NBE), the like, or a combination thereof.

As shown in FIG. 1I, a gate dielectric layer 150 is blanketly formed onthe isolation portions 122 and the epitaxial fins 130. In someembodiments, the gate dielectric layer 150 is a high-k dielectric layer.For example, the gate dielectric layer 150 may include hafnium oxide(HfO2), hafnium silicon oxide (HfSiO), hafnium silicon oxynitride(HfSiON), hafnium tantalum oxide (HfTaO), hafnium titanium oxide(HfTiO), hafnium zirconium oxide (HfZrO), or another suitable high-kdielectric material. The high-k material may further include metaloxides, metal nitrides, metal silicates, transition metal-oxides,transition metal-nitrides, transition metal-silicates, oxynitrides ofmetals, metal aluminates, zirconium silicate, zirconium aluminate,silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide,titanium oxide, aluminum oxide, hafnium dioxide-alumina (HfO₂—Al₂O₃)alloy, or another suitable material. In some embodiments, the gatedielectric layer 150 can be formed by using a operation such as chemicalvapor deposition (CVD), plasma enhanced chemical vapor deposition(PECVD), or low pressure chemical vapor deposition (LPCVD).

As shown in FIG. 1J, spacers 160 and gate electrode 170 are formed onthe gate dielectric layer 150. In some embodiments, the spacers 160 areformed from a dielectric material, such as silicon nitride, siliconcarbide, silicon oxynitride, other suitable materials, and/orcombinations, but embodiments of the present disclosure are not limitedthereto. The spacers 160 may be formed by methods utilized to form sucha layer, such as chemical vapor deposition (CVD), plasma enhanced CVD,sputter, and other methods known in the art.

In some embodiments, the gate electrode layer 170 may be formed from aconductive material and may be selected from a group comprising ofpolycrystalline-silicon (poly-Si), poly-crystalline silicon-germanium(poly-SiGe), metallic nitrides, metallic silicides, metallic oxides,metals, combinations of these, and the like. Examples of metallicnitrides include tungsten nitride, molybdenum nitride, titanium nitride,and tantalum nitride, or their combinations. Examples of metallicsilicide include tungsten silicide, titanium silicide, cobalt silicide,nickel silicide, platinum silicide, erbium silicide, or theircombinations. Examples of metallic oxides include ruthenium oxide,indium tin oxide, or their combinations. Examples of metal includetungsten, titanium, aluminum, copper, molybdenum, nickel, platinum, etc.The gate electrode layer 170 may be deposited by chemical vapordeposition (CVD), sputter deposition, or other techniques known and usedin the art for depositing conductive materials.

As shown in FIG. 1K, portions of the gate dielectric layer 150 areremoved to expose the epitaxial fins 130. In some embodiments, a portionof the gate dielectric layer 150 covered by the spacers 160 and the gateelectrode 170 remains, and the other portions of the gate dielectriclayer 150 not covered by the spacers 160 and the gate electrode 170 areetched to expose underlying epitaxial fins 130.

As shown in FIG. 1L, sources/drains 180 are formed on the exposedepitaxial fins 130 and cover the epitaxial fins 130. In someembodiments, the sources/drains 180 are formed from silicon germaniumand epitaxially grown from a surface of the fins 114, but embodiments ofthe present disclosure are not limited thereto. In some embodiments, adoping operation may be conducted on the sources/drains 180 to dope thesources/drains 180 with an n-type or p-type dopant.

Referring to FIG. 2A, FIG. 2A is a flow chart showing a method 200 forcleaning a wafer having polished epitaxial channel structures as shownin FIG. 1G. The method 200 includes plural operations conducted on thewafer to clean the exposed surfaces of the epitaxial channel structures.In the method 200, at first, an oxidizer rinse operation 210 isconducted to clean the wafer. In some embodiments, as shown in FIG. 2B,a rinse cleaning device used in the oxidizer rinse operation 210includes rollers 211 and spray bars 212 to clean a wafer 100 havingpolished epitaxial channel structures. The wafer 100 is placed on therollers 2 to enable the wafer 100 to be rotated. When the oxidizer rinseoperation 210 is conducted, the spray bars 212 provide a solution withan oxidizing agent onto the wafer 100, thereby cleaning the exposedsurfaces of the polished epitaxial channel structures of the wafer 100.

In some embodiments, the solution with an oxidizing agent is used todecrease the interface adhesion between the residues/particles and theexposed surfaces of the epitaxial channel structures. A cleaningchemical of the oxidizing agent include ozone and de-ionized water(DIO₃), hydrogen peroxide(H₂O₂), a solution of ammonium persulfate((NH₄)₂S₂O₈), sodium hypochlorite(NaClO), sulfuric peroxide mixture(SPM), a solution of NH₃/H₂O₂/H₂O (SC1), a solution of HCl/H₂O₂/H₂O(SC2) or a combination thereof. In some embodiments, a concentration ofthe ozone in DIO₃ is in a range substantially from 1 ppm to 10 ppm, aconcentration of the hydrogen peroxide is in a range substantially from0.1 weight % to 10 weight %, a concentration of ammonium persulfate isin a range substantially from 0.1 weight % to 44 weight %, and aconcentration of the sodium hypochlorite is in a range substantiallyfrom 0.1 weight % to 16 weight %.

Then, operation 220 is conducted on the wafer 100. The operation 220includes at least one contact or non-contact-type cleaning operation.The operation 220 includes at least one clean operation which is acontact-type cleaning operation or non-contact-type cleaning operation.In some embodiments, the operation 220 includes one contact-typecleaning operation and two non-contact-type cleaning operations. At theoperation 220, the contact-type cleaning operation 222 is conducted atfirst, and then the two non-contact-type cleaning operations 224 and 226are conducted sequentially. However, embodiments of the presentdisclosure are not limited thereto. In some embodiments, thenon-contact-type cleaning operations are conducted at first, and thenthe contact-type cleaning operation is conducted. In some embodiments,the operation 220 includes three contact-type cleaning operations. Insome embodiments, the operation 220 includes two contact-type cleaningoperations and one non-contact-type cleaning operation. In someembodiments, the operation 220 includes three non-contact-type cleaningoperations.

Referring to FIG. 2C, FIG. 2C is a schematic diagram showing acontact-type cleaning device used in the contact-type cleaning operationin accordance with some embodiments of the present disclosure. In thiscase, a soft pad cleaner is used in the contact-type cleaning operationof the operation 220. However, embodiments of the present disclosure arenot limited thereto. In some embodiments, other clean device, such as apencil cleaner (such as a pencil type brush) or a roller cleaner (suchas a roller type brush) can be used in the operation 220.

As shown in FIG. 2C, the contact-type cleaning device includes asupporter 213, a soft pad 214, a carrier 215 and a nozzle 216. Thesupporter 213 is used to support the soft pad 214, the carrier 215 isused to carry the wafer 100, and the nozzle 216 is used to provide acleaning chemical onto the soft pad 214. When the contact-type cleaningdevice cleans the wafer 100, the supporter 213 is rotated to enable thesoft pad 214 disposed on the supporter 213 to rotate, and the nozzle 216provides the cleaning chemical onto the soft pad 214. Therefore, thewafer 100 can be cleaned by the cleaning chemical. In some embodiments,the carrier 215 can be rotated to rotate the semiconductor device 100carried by the carrier 215. In some embodiments, the soft pad 214 issimilar to a soft pad used in the chemical mechanical polish (CMP), butembodiments of the present disclosure are not limited thereto.

Referring to FIG. 2D, FIG. 2D is a schematic diagram showing anon-contact-type cleaning device used in the non-contact-type cleaningoperation of the operation 220 in accordance with the presentdisclosure. In this case, the non-contact-type cleaning device is ajet-spray cleaner. However, embodiments of the present disclosure arenot limited thereto. In some embodiments, other clean device, such as anultrasonic (20˜400 kHz) cleaner or a megasonic (0.4˜5 MHz) cleaner canbe used in the operation 220.

As shown in FIG. 2D, the non-contact-type cleaning device includes achamber 217, a jet nozzle 218 and a slurry delivery arm 219. The chamber217 is used to receive the wafer 100. The jet nozzle 218 is disposed onthe slurry delivery arm 219 to provide a cleaning chemical onto thewafer 100. In some embodiments, gas (such as Ar) and the cleaningchemical are provided to the jet nozzle 218, thereby enabling the jetnozzle 218 to provide the cleaning chemical with a flow rate in a rangesubstantially from 300 cc/min to 1000 cc/min, but embodiments of thepresent disclosure are not limited thereto. In some embodiments, thewafer 100 is rotated in the chamber 217, but embodiments of the presentdisclosure are not limited thereto.

In some embodiments, the contact-type cleaning operation and thenon-contact-type cleaning operation uses cleaning chemical includingde-ionized water (DIW), ammonium hydroxide (NH₄OH), ozone and de-ionizedwater (DIO₃), hydrogen peroxide(H₂O₂), a solution of ammonium persulfate((NH₄)₂S₂O₈), sodium hypochlorite(NaClO), sulfuric peroxide mixture(SPM), a solution of NH₃/H₂O₂/H₂O (SC1), a solution of HCl/H₂O₂/H₂O(SC2), diluted hydrofluoric acid (hydrogen fluoride), dilutedhydrochloric acid (HCl), Anionic Surfactant, Cationic surfactant,Non-ionic Surfactant, Zwitterionic Surfactants or a combination thereof.Further, in some embodiments, a concentration of the ozone in DIO₃ is ina range substantially from 1 ppm to 10 ppm. In some embodiments, aconcentration of the hydrogen peroxide is in a range substantially from0.1 weight % to 10 weight %. In some embodiments, a concentration of theammonium hydroxide is in a range substantially from 0.01 weight % to 2weight %. In some embodiments, a concentration of ammonium persulfate isin a range substantially from 0.1 weight % to 44 weight %. In someembodiments, a concentration of the sodium hypochlorite is in a rangesubstantially from 0.1 weight % to 16 weight %. In some embodiments, aconcentration of the hydrogen fluoride is in a range substantially from0.01 weight % to 2 weight %. In some embodiments, a concentration of thehydrochloric acid is in a range substantially from 0.01 weight % to 2weight %.

Returning to FIG. 2A, after the operation 220, a cleaning cycleoperation 230 is conducted on the wafer 100. Referring to FIG. 2E, FIG.2E is a flow chart showing the cleaning cycle operation 230 inaccordance with some embodiments of the present disclosure. In thecleaning cycle operation 230, at first, a diluted hydrofluoric acidclean operation 231 is conducted on the wafer 100. In some embodiments,a concentration of the diluted hydrofluoric acid is in a rangesubstantially from 0.1 weight % to 2 weight %. Then, de-ionized water(DIW) rinse operation 232 is conducted on the wafer 100. Thereafter, anoxidizer clean operation 233 is conducted on the wafer 100. In someembodiments, the oxidizer clean operation 233 is similar to the oxidizerrinse operation 210 as shown in FIG. 2B, but embodiments of the presentdisclosure are not limited thereto. Then, another de-ionized water (DIW)rinse operation 234 is conducted on the wafer 100. In some embodiments,the de-ionized water (DIW) rinse operation 234 is similar to thede-ionized water (DIW) rinse operation 232, but embodiments of thepresent disclosure are not limited thereto. For example, in someembodiments, the de-ionized water (DIW) rinse operation 234 is differentfrom the de-ionized water (DIW) rinse operation 232.

Thereafter, the operations 231-234 may be repeated to clean the wafer100. Cycling times of the operations 232-238 may be determined by user'sdemands for better cleaning performance. After the de-ionized water(DIW) rinse operation 234, another diluted hydrofluoric acid cleanoperation 235 is conducted on the wafer 100. In some embodiments, thediluted hydrofluoric acid clean operation 235 is similar to the dilutedhydrofluoric acid clean operation 231, but embodiments of the presentdisclosure are not limited thereto. For example, in some embodiments,the diluted hydrofluoric acid clean operation 235 is different from thediluted hydrofluoric acid clean operation 231. Then, another de-ionizedwater (DIW) rinse operation 236 is conducted on the wafer 100. In someembodiments, the de-ionized water (DIW) rinse operation 236 is similarto the de-ionized water (DIW) rinse operation 232, but embodiments ofthe present disclosure are not limited thereto. For example, in someembodiments, the de-ionized water (DIW) rinse operation 236 is differentfrom the de-ionized water (DIW) rinse operation 232. In someembodiments, the de-ionized water (DIW) rinse operations 232, 234 and236 may be omitted.

After cleaning the wafer 100, a dry operation is conducted to dry thewafer 100. In some embodiments, the dry operation may be spin rinse dry,or isopropyl alcohol (IPA) vapor dry. For example, when the IPA vapordry is conducted, the wafer 100 is placed into a sealed vessel, and thenIPA vapor is directed to the wafer 100 to remove water from the wafer100.

In the above embodiments, the cleaning cycle operation 230 begins at thediluted hydrofluoric acid clean operation 231 and ends at the dilutedhydrofluoric acid clean operation 235 (when the de-ionized water (DIW)rinse operation 236 is omitted). However, in some embodiments, thediluted hydrofluoric acid clean operation 235 and the de-ionized water(DIW) rinse operations 236 are omitted, and the cleaning cycle operation230 ends at the oxidizer clean operation 233 (when the de-ionized water(DIW) rinse operations 234 is omitted.

Further, in some embodiments, the cleaning cycle operation 230 begins atthe oxidizer clean operation 233, as shown in FIG. 2F. In someembodiments, the cleaning cycle operation 230 begins at the oxidizerclean operation 233 and ends at an oxidizer clean operation 237 (whenthe de-ionized water (DIW) rinse operation 236 is omitted), in which,the oxidizer clean operation 237 is similar to the oxidizer cleanoperation 233, but embodiments of the present disclosure are not limitedthereto. In some embodiments, the oxidizer clean operation 237 and thede-ionized water (DIW) rinse operations 236 are omitted, and thecleaning cycle operation 230 ends at the diluted hydrofluoric acid cleanoperation 231 (when the de-ionized water (DIW) rinse operations 234 isomitted).

In some embodiments, operation 220 and operation 230 are repeated forbetter clean performance, as shown in FIG. 2G. Cycling times of theoperations 220-230 may be determined by user's demands. In someembodiments, one or more operations in the method 200 for cleaning theexposed surfaces of the epitaxial channel structures can be omitted inaccordance with user's demands. For example, oxidizer rinse operation210 can be omitted, as shown in FIG. 2H. For another example, theoperation 220 (including contact/non-contact-type cleaning operations)can be omitted, as shown in FIG. 2I. For still another example, oxidizerrinse operation 210 and the cleaning cycle operation 230 are omitted, asshown in FIG. 2J. For still another example, the cycling times ofoperations 220-230 can be decreased. For still another example, thecycling times of the operations 232-238 of the cleaning cycle operation230 can be decreased.

Hereinafter, two examples are presented to show that the method 200 iscapable of removing a significant amount of organic residues and smallparticles on the wafer 100. Referring to FIG. 2K, FIG. 2K shows x-rayphotoelectron spectroscopy (XPS) measurements of organic residues on thewafer 100 in accordance with a first example. A curve 251 represents theamount of organic residues on the wafer 100 after the epitaxial fins 130are epitaxially grown on the fins 114, a curve 252 represents the amountof organic residues on the wafer 100 after a CMP is performed on theepitaxial fins 130, and a curve 253 represents the amount of organicresidues on the wafer 100 after the method 200 is performed on the wafer100 after the CMP is performed, in which chemicals used in the method200 of the first example include the diluted hydrofluoric acid, thediluted hydrochloric acid and the de-ionized water. As shown in FIG. 2K,when the method 200 reduces a significant amount of organic residues.

Referring to FIG. 2L, FIG. 2L shows x-ray photoelectron spectroscopy(XPS) measurements of organic residues on the wafer 100 in accordancewith a second example. A curve 254 represents the amount of organicresidues on the wafer 100 after the epitaxial fins 130 are epitaxiallygrown on the fins 114, a curve 255 represents the amount of organicresidues on the wafer 100 after a CMP is performed on the epitaxial fins130, and a curve 256 represents the amount of organic residues on thewafer 100 after the method 200 is performed on the wafer 100 after theCMP is performed, in which chemicals used in the method 200 of thesecond example include the SPM, the diluted hydrofluoric acid, and theSC1. As shown in FIG. 2L, the method 200 reduces a significant amount oforganic residues.

Further, small size particles on the wafer 100 can be significantlydecreased by 50% to 55% when the wafer 100 is cleaned by using themethod 200. In this case, the operations 231-234 of the cleaning cycleoperation 230 are repeated two times.

Referring to FIG. 3, FIG. 3 is a flow chart showing a method 300 formanufacturing a FinFET device in accordance with some embodiments of thepresent disclosure. The method 300 begins at operation 302. At operation302, the semiconductor substrate 110 is provided, as shown in FIG. 1A.Then, at operation 304, the semiconductor substrate 110 is etched toform the fins 114, as shown in FIG. 1B. Thereafter, at operation 306,the insulation material structure 120 is formed around the fins 114, asshown in FIG. 1C. Then, at operation 308, the top portion 124 of theinsulation material structure 120 is removed to expose top surfaces 114Sof the fins 114, as shown in FIG. 1D. Thereafter, at operation 310, thefins 114 are recessed, as shown in FIG. 1E. Then, at operation 312, theepitaxial fins 130 are epitaxially grown over the recessed fins 114, asshown in FIG. 1F. Thereafter, at operation 314, the planarizationoperation is conducted to polish the top of the isolation portions 122and the epitaxial fins 130 to form the flat surface 140, as shown inFIG. 1G. Then, at operation 316, the exposed surfaces of the epitaxialfins 130 are cleaned by using the clean method 200. In some embodiments,the dry operation is conducted to dry the exposed surfaces of theepitaxial fins 130.

After the exposed surfaces of the epitaxial fins 130 are dried, atoperation 318, the isolation portions 122 of the insulation materialstructure 120 are recessed such that the epitaxial fins 130 protrudefrom the recessed insulation structure, as shown in FIG. 1H. Then, atoperation 320, the gate dielectric layer 150 is blanketly formed on theisolation portions 122 and the epitaxial fins 130, as shown in in FIG.1I. Thereafter, at operation 322, the spacers 160 and the gate electrode170 are formed on the gate dielectric layer 150, as shown in FIG. 1J.Then, at operation 324, portions of the gate dielectric layer 150 areremoved to expose portions of the epitaxial fins 130, as shown in FIG.1K. Thereafter, at operation 326, the sources/drains 180 are formed onthe exposed portions of the exposed epitaxial fins 130 and cover theepitaxial fins 130, as shown in FIG. 1L. In some embodiments, theoperation 316 for cleaning the exposed surfaces of the epitaxial fins130 and the operation 314 for forming the flat surface 140 can beperformed at the same tool.

In the above embodiments, because the epitaxial channel structures arehydrophobic, extra wetting agents or surfactants are used at operationfor polishing the epitaxial channel structures. However, these wettingagents and surfactants are organic compounds induce visible ornon-visible polymer residues and organic particles on the surfaces ofthe epitaxial channel structures, and severe impact device performanceor product yield. Therefore, the method 200 is conducted on a waferhaving the epitaxial channel structures to clean exposed surfaces of theepitaxial channel structures. In some embodiments, the method 200includes an oxidizer rinse operation, contact or non-contact-typecleaning operations and a cleaning cycle operation, thereby efficientlyremoving the residues and particles from the exposed (polished) surfacesof the epitaxial channel structures.

In accordance with an embodiment of the present disclosure, the presentdisclosure discloses a method for manufacturing a semiconductor device.In the method for manufacturing a semiconductor device, at first, asemiconductor substrate of a wafer is etched to form at least one fin.Then, an insulation structure is formed around the fin. Thereafter, thefin is recessed. Then, an epitaxial channel structure is epitaxiallygrown over the recessed fin. Thereafter, a portion of the epitaxialchannel structure over a top surface of the insulation structure isremoved. Then, a non-contact-type cleaning operation is performed toclean a top surface of the wafer after removing said portion of theepitaxial channel structure. Thereafter, the top surface of the wafer iscleaned using hydrogen fluoride after removing said portion of theepitaxial channel structure. Then, the insulation structure is recessed,such that the epitaxial channel structure protrudes from the recessedinsulation structure.

In some embodiments, the non-contact-type cleaning operation includessonic cleaning the top surface of the wafer.

In some embodiments, the non-contact-type cleaning operation includesspraying a fluid to the top surface of the wafer.

In some embodiments, the non-contact-type cleaning operation includesspinning the wafer.

In some embodiments, the method further includes rinsing the top surfaceof the wafer using a solution with an oxidizing agent prior to thenon-contact-type cleaning operation

In some embodiments, the method further includes cleaning the topsurface of the wafer using a solution with an oxidizing agent afterremoving said portion of the epitaxial channel structure.

In some embodiments, the operation for cleaning the top surface of thewafer using hydrogen fluoride is performed prior to cleaning the topsurface of the wafer using the solution with an oxidizing agent.

In some embodiments, the operation for cleaning the top surface of thewafer using the solution with an oxidizing agent is performed prior tocleaning the top surface of the wafer using hydrogen fluoride.

In some embodiments, the method further includes rinsing the top surfaceof the wafer after cleaning the top surface of the wafer using thesolution with an oxidizing agent.

In some embodiments, the method further includes rinsing the top surfaceof the wafer after cleaning the top surface of the wafer using hydrogenfluoride.

In accordance with an embodiment of the present disclosure, the presentdisclosure discloses a method for manufacturing a semiconductor device.In the method for manufacturing a semiconductor device, at first, asemiconductor substrate of a wafer is etched to form at least one fin.Then, an insulation structure is formed around the fin. Thereafter, thefin is recessed. Then, an epitaxial channel structure is epitaxiallygrown over the recessed fin. Thereafter, a portion of the epitaxialchannel structure over a top surface of the insulation structure, suchthat a top surface of the other portion of the epitaxial channelstructure is exposed from the top surface of the insulation structure.Then, a first non-contact-type cleaning operation is performed to cleanthe top surface of the other portion of the epitaxial channel structureafter removing said portion of the epitaxial channel structure.Thereafter, the top surface of the other portion of the epitaxialchannel structure is cleaned using a solution with an oxidizing agentafter removing said portion of the epitaxial channel structure. Then,the insulation structure is recessed, such that the epitaxial channelstructure protrudes from the recessed insulation structure.

In some embodiments, the operation for cleaning the top surface of theother portion of the epitaxial channel structure using the solution withan oxidizing agent is performed after the first non-contact-typecleaning operation.

In some embodiments, the method further includes rinsing the top surfaceof the other portion of the epitaxial channel structure prior toperforming the first non-contact-type cleaning operation.

In some embodiments, the method further includes performing acontact-type cleaning operation to clean the top surface of the otherportion of the epitaxial channel structure after removing said portionof the epitaxial channel structure.

In some embodiments, the method further includes performing a secondnon-contact-type cleaning operation to clean the top surface of theother portion of the epitaxial channel structure after performing thefirst non-contact-type cleaning operation.

In accordance with an embodiment of the present disclosure, the presentdisclosure discloses a method for manufacturing a semiconductor device.In the method for manufacturing a semiconductor device, at first, asemiconductor substrate of a wafer is etched to form at least one fin.Then, an insulation structure is formed around the fin. Thereafter, thefin is recessed. Then, an epitaxial channel structure is epitaxiallygrown over the recessed fin. Thereafter, a portion of the epitaxialchannel structure over a top surface of the insulation structure, suchthat a top surface of the other portion of the epitaxial channelstructure is exposed from the top surface of the insulation structure.Then, the top surface of the other portion of the epitaxial channelstructure is cleaned using hydrogen fluoride after removing said portionof the epitaxial channel structure. Thereafter, the top surface of theother portion of the epitaxial channel structure is cleaned using asolution with an oxidizing agent after removing said portion of theepitaxial channel structure. Then, the insulation structure is recessed,such that the epitaxial channel structure protrudes from the recessedinsulation structure.

In some embodiments, the method further includes repeating cleaning thetop surface of the other portion of the epitaxial channel structureusing hydrogen fluoride and cleaning the top surface of the wafer usingthe solution with an oxidizing agent.

In some embodiments, the method further includes cleaning the topsurface of the other portion of the epitaxial channel structure using abrush prior to cleaning the top surface of the wafer using hydrogenfluoride.

In some embodiments, the method further includes cleaning the topsurface of the other portion of the epitaxial channel structure using acleaning pad prior to cleaning the top surface of the wafer usinghydrogen fluoride.

In some embodiments, the method further includes cleaning the topsurface of the other portion of the epitaxial channel structure using asponge cleaner prior to cleaning the top surface of the wafer usinghydrogen fluoride.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing a semiconductordevice, the method comprising: etching a semiconductor substrate of awafer to form at least one fin; forming an insulation structure aroundthe fin; recessing the fin; epitaxially growing an epitaxial channelstructure over the recessed fin; removing a portion of the epitaxialchannel structure over a top surface of the insulation structure;performing a non-contact-type cleaning operation to clean a top surfaceof the wafer after removing said portion of the epitaxial channelstructure; cleaning the top surface of the wafer using hydrogen fluorideafter removing said portion of the epitaxial channel structure; andrecessing the insulation structure such that the epitaxial channelstructure protrudes from the recessed insulation structure.
 2. Themethod of claim 1, wherein the non-contact-type cleaning operationcomprises sonic cleaning the top surface of the wafer.
 3. The method ofclaim 1, wherein the non-contact-type cleaning operation comprisesspraying a fluid to the top surface of the wafer.
 4. The method of claim3, wherein the non-contact-type cleaning operation comprises spinningthe wafer.
 5. The method of claim 1, further comprising: rinsing the topsurface of the wafer using a solution with an oxidizing agent prior tothe non-contact-type cleaning operation.
 6. The method of claim 1,further comprising: cleaning the top surface of the wafer using asolution with an oxidizing agent after removing said portion of theepitaxial channel structure.
 7. The method of claim 6, wherein cleaningthe top surface of the wafer using hydrogen fluoride is performed priorto cleaning the top surface of the wafer using the solution with anoxidizing agent.
 8. The method of claim 6, wherein cleaning the topsurface of the wafer using the solution with an oxidizing agent isperformed prior to cleaning the top surface of the wafer using hydrogenfluoride.
 9. The method of claim 6, further comprising: rinsing the topsurface of the wafer after cleaning the top surface of the wafer usingthe solution with an oxidizing agent.
 10. The method of claim 1, furthercomprising: rinsing the top surface of the wafer after cleaning the topsurface of the wafer using hydrogen fluoride.
 11. A method formanufacturing a semiconductor device, the method comprising: etching asemiconductor substrate of a wafer to form at least one fin; forming aninsulation structure around the fin; recessing the fin; epitaxiallygrowing an epitaxial channel structure over the recessed fin; removing aportion of the epitaxial channel structure over a top surface of theinsulation structure, such that a top surface of the other portion ofthe epitaxial channel structure is exposed from the top surface of theinsulation structure; performing a first non-contact-type cleaningoperation to clean the top surface of the other portion of the epitaxialchannel structure after removing said portion of the epitaxial channelstructure; cleaning the top surface of the other portion of theepitaxial channel structure using a solution with an oxidizing agentafter removing said portion of the epitaxial channel structure; andrecessing the insulation structure such that the epitaxial channelstructure protrudes from the recessed insulation structure.
 12. Themethod of claim 11, wherein cleaning the top surface of the otherportion of the epitaxial channel structure using the solution with anoxidizing agent is performed after the first non-contact-type cleaningoperation.
 13. The method of claim 11, further comprising: rinsing thetop surface of the other portion of the epitaxial channel structureprior to performing the first non-contact-type cleaning operation. 14.The method of claim 11, further comprising: performing a contact-typecleaning operation to clean the top surface of the other portion of theepitaxial channel structure after removing said portion of the epitaxialchannel structure.
 15. The method of claim 11, further comprising:performing a second non-contact-type cleaning operation to clean the topsurface of the other portion of the epitaxial channel structure afterperforming the first non-contact-type cleaning operation.
 16. A method,comprising: etching a semiconductor substrate of a wafer to form atleast one fin; forming an insulation structure around the fin; recessingthe fin; epitaxially growing an epitaxial channel structure over therecessed fin; removing a portion of the epitaxial channel structure overa top surface of the insulation structure, such that a top surface ofthe other portion of the epitaxial channel structure is exposed from thetop surface of the insulation structure; cleaning the top surface of theother portion of the epitaxial channel structure using hydrogen fluorideafter removing said portion of the epitaxial channel structure; cleaningthe top surface of the other portion of the epitaxial channel structureusing a solution with an oxidizing agent after removing said portion ofthe epitaxial channel structure; and recessing the insulation structuresuch that the epitaxial channel structure protrudes from the recessedinsulation structure.
 17. The method of claim 16, further comprising:repeating cleaning the top surface of the other portion of the epitaxialchannel structure using hydrogen fluoride and cleaning the top surfaceof the wafer using the solution with an oxidizing agent.
 18. The methodof claim 16, further comprising: cleaning the top surface of the otherportion of the epitaxial channel structure using a brush prior tocleaning the top surface of the wafer using hydrogen fluoride.
 19. Themethod of claim 16, further comprising: cleaning the top surface of theother portion of the epitaxial channel structure using a cleaning padprior to cleaning the top surface of the wafer using hydrogen fluoride.20. The method of claim 16, further comprising: cleaning the top surfaceof the other portion of the epitaxial channel structure using a spongecleaner prior to cleaning the top surface of the wafer using hydrogenfluoride.